Main Feature:
1, to achieve 3D MID (MoldedInterconnect Device) process, the new frame and tilt structure can be three-dimensional assembly of concave and convex surface, inclined surface and curved surface, helping customers to achieve a leap from flat panel assembly to three-dimensional assembly, reducing assembly costs.
2, to achieve a combination of spot solder paste / point red glue / patch / plug-in function, and easy to switch, non-contact point plastic head can be spot solder paste on the cavity substrate to achieve stereoscopic three-dimensional assembly of uneven surface.
3, optical inspection of the spot solder paste and glue and the mounted components, the newly developed color mark point recognition camera can also perform stable optical inspection of the solder paste/glue shape and patch effect through the new illumination system (realizing AOI) +SPI function)
4, 2 types of head structure are available for selection, 6 patch head 6 rotation axis type and 12 patch head 2 rotation axis type.
5, large substrate assembly capability, the substrate can be up to 1825mmx 635mm (optional) without segmentation once board capacity 1240mm x 510mm
6, ultra-wide component range, from ultra-small 0201 (0.25x0.125mm) chip to 120mm large components can be processed, placement height of 35mm, easy to install ultra-high components.
7, super large feeding capacity, S20 8mm loading port reaches 4 * 45 = 180 types, S10 8mm loading port reaches 2 * 45 = 90 types, waffle plate loading 36 types and can achieve non-stop refueling.
8, motor gun and refueling car and achieve interchange with M10/M20.
